IBM Delivers World's First Copper Chips
Original Document
IBM Delivers World's First Copper Chips
Fishkill, N.Y., September 1, 1998
IBM today announced the shipment of the world's first copper-based microprocessors,
including a PowerPC 740/750 operating
at 400MHz. The company also announced several other initiatives associated
with copper, including availability of the fastest embedded processor
on the market, a 400 MHz embedded PowerPC chip.
IBM also announced it will incorporate copper into its S/390,
RS/6000, and AS/400
server families, with prototypes planned for 1998 and production systems
planned for 1999. In addition, the company stated it will immediately
broaden the use of copper in the marketplace by building copper chips
for other companies through its standard foundry services. This leadership
CMOS 7SF technology at industry standard .18 microns is planned for prototypes
in the first quarter of 1999 and for production in the second half of
1999.
IBM's copper chip technology is being used to enhance chip performance,
while reducing die size and power consumption. IBM is the first chip maker
to introduce copper-based microprocessors and embedded processors for
use in an assortment of electronic products, from computers to consumer
appliances.
The new 400MHz microprocessors, the fastest PowerPC products on the
market, are available in versions for both desktop and mobile computing
and are being incorporated into a variety of consumer and business products.
The attributes of copper increase the versatility of the PowerPC 740/750
and will continue to provide significant performance improvements in the
future.
Today's announcement illustrates the advantages IBM's copper technology
can bring to customers. The PowerPC 750 was created as a standard aluminum
design operating at up to 300 MHz. By applying IBM's copper manufacturing
process to what is essentially the same chip, the company can now produce
semiconductors featuring speeds of at least 400MHz--a 33 percent performance
improvement for the same chip.
"This represents a milestone in the evolution of semiconductor manufacturing
process technology and underscores our commitment to the PowerPC architecture,"
said John Gleason, General Manager of Worldwide Sales and Marketing, IBM
Microelectronics. "By combining leading process technology like copper
with a powerful, flexible architecture, we're able to offer electronics
designers a new range of options, such as single-function processors for
embedded applications, which are becoming pervasive in a range of products,
including those that tie to the Internet and the networked world."
The suitability of the PowerPC 740/750 400MHz for embedded processor
applications underscores how IBM's extensive high-end design and manufacturing
capabilities are driving the company's success in embedded PowerPC business.
The PowerPC architecture is closely linked to IBM's strategic focus on
the custom logic business. The chip's smaller die size and lower power
requirements achieved through IBM's copper technology allow the company
to immediately offer PowerPC for embedded applications.
"IBM's ability to leverage its advanced process technology is fueling
an explosive 50 percent growth rate in embedded PowerPC applications,"
said Ron Tessitore, Director, Microcontroller Development, IBM Microelectronics.
"By exploiting advances in IBM's process technology, such as copper, we
plan to continue to gain share in the embedded market with PowerPC."
Embedded products are ideally suited for applications such as wired
communications, printers, storage systems, and numerous consumer electronics
products (digital cameras, cellular phones, and digital set top boxes).
Offering significantly higher clock speeds, lower power consumption, and
smaller die sizes than their aluminum-based predecessors, these products
can be incorporated into current PowerPC 740/750-based designs without
significant modification. This allows electronics manufacturers to readily
increase both the speed and breadth of their end products without costly
design changes.
Aluminum has long been the standard material used for semiconductor
wiring. While copper was recognized as a superior conductor of electricity
than aluminum, until now it has been more difficult to adapt to semiconductor
manufacturing. IBM announced in September of 1997 that it had adapted
copper for volume manufacturing. Now, less than a year later, IBM is putting
that technology into production.
The newly announced PowerPC 750 up to and including 400MHz for desktop
and mobile computing and embedded applications is currently available.
The newly announced PowerPC 740, up to and including 400MHz for embedded
applications, will be available in the first quarter of 1999. For more
information on pricing and availability, contact a local IBM sales representative.
PowerPC, S/390, RS/6000,
and AS/400 are trademarks or registered trademarks of IBM.