AMD EXPANDS MOBILE PROCESSOR FAMILY WITH INTRODUCTION OF WORLD'S FASTEST x86 CPUs FOR NOTEBOOK COMPUTING

--Mobile AMD-K6®-2-P/475 is the highest clock speed CPU available for x86 notebook computing--
--Mobile AMD-K6-III-P/450MHz offers the highest performance for x86 notebook computing on demanding business applications--

SUNNYVALE, CA-- SEPTEMBER 20, 1999-- AMD today expanded its mobile processor line with the introduction of new speed grades for both the Mobile AMD-K6®-2-P and the Mobile AMD-K6-III-P processor families. The Mobile AMD-K6-III-P processor is now available in speeds of 450MHz, 433MHz and 400MHz, while the Mobile AMD-K6-2-P is available at 475MHz, 450MHz and 433MHz. AMD continues to offer the only mobile processors that support advanced features such as a 100MHz-frontside bus and 3DNow!™ technology.

"AMD has seen a dramatic growth in its portable market share since the introduction of the Mobile AMD-K6-2 family of products earlier this year," said Dana Krelle, vice president of marketing for AMD's Computation Products Group. "The most recent market share numbers from PC Data Inc. show that AMD-K6 processor-based notebooks reached an all-time high U.S. retail market share of 67 percent in July. The addition of these new processor speed grades reflects our commitment to continue introducing leading technology into the notebook market, offering our customers the best performance and value at all system price points."

"The highly awarded Compaq Prosignia Notebook 150 with AMD processors has been enthusiastically received by small and medium businesses w>orldwide,"said Bill Hensler, general manager and vice president, small and medium business division, Compaq. "We are excited about offering our customers these new high performance processor speeds from AMD on the Compaq notebooks that combine the out-of-the-box productivity and ground-breaking price performance that our customers demand."

"Compaq Presario Internet notebooks are the leading brand in the U.S. retail market because of the high level of performance and value we provide to our customers," said Kevin Frost, Director and General Manager, Mobile Consumer Products, Compaq Computer Corporation. "As we announce new models of the Presario 1600 Series Notebook with the latest Mobile AMD-K6-2-processors, we continue to deliver on that winning combination."

Mobile AMD-K6®-III-P Offers Market Leadership Performance
The Mobile AMD-K6-III-P/450 offers market-leading Windows® 98 and Windows NT® performance and outperforms Intel's fastest available Mobile Pentium® II processor by more than 45 percent on Ziff-Davis Inc.'s CPUMark99™ benchmark.

The Mobile AMD-K6-III-P processor incorporates AMD's innovative TriLevel Cache™ design to enable leading-edge performance. The TriLevel Cache design enhances overall system performance of Mobile AMD-K6-III-P processor-based notebook PCs by enabling the mobile computer industry's largest combined system cache. -more-

The TriLevel Cache architecture includes a full-speed 64KByte Level 1 (L1) cache, an internal full processor-speed backside 256KByte Level 2 (L2) cache, and a 100MHz frontside bus to an optional external Level 3 (L3) cache of up to 1MByte.

The Mobile AMD-K6-III-P processor also incorporates AMD's 3DNow! technology for great performance on applications such as 3D graphics, soft DVD playback and speech recognition.

The new Mobile AMD-K6-III-P processors operate at a core voltage of 2.0 volts, have an extended case temperature rating of 80僀, and dissipate approximately 12 watts of power running typical applications.

These 21.3-million transistor processors are manufactured on AMD's 0.25-micron, five-layer-metal process technology at AMD's Fab 25 wafer fabrication facility in Austin, Texas.

About the Mobile AMD-K6-2-P Processor
The Mobile AMD-K6-2-P processor with 3DNow! technology delivers excellent performance for today's demanding Microsoft® Windows® compatible home and office applications. The 9.3-million-transistor Mobile AMD-K6-2-P processor is manufactured on AMD's 0.25-micron, five-layer-metal process technology using local interconnect and shallow trench isolation at AMD's Fab 25 wafer fabrication facility in Austin, Texas. The Mobile AMD-K6-2-P processor is packaged in a Super7™ platform-compatible, 321-ceramic pin grid array (CPGA) package using C4 flip-clip interconnection technology.

About 3DNow!™ Technology
3DNow! technology, developed by AMD, was the first innovation to the x86 architecture that significantly enhanced floating-point-intensive 3D graphics and multimedia applications. It uses single instruction multiple data (SIMD) and other performance enhancements to provide a compelling visual computing experience.

The worldwide installed base of 3DNow! technology-enhanced PCs has grown to more than 15 million desktop and notebook systems. Support for 3DNow! technology exists today in leading industry-standard application programming interfaces (APIs), including Microsoft's DirectX 6.x and SGI's OpenGL APIs. In addition, numerous hardware and software products have been optimized for 3DNow! technology.

For a detailed list of hardware and software products that support 3DNow! technology, visit the AMD web site at http://www1.amd.com/products/cpg/3dnow/optimized. Leading software titles optimized for 3DNow! technology are available online at the 3DNow! Technology Aisle on Chumbo.com.

Pricing
The Mobile AMD-K6-III-P/450MHz is priced at $320 in 1,000-unit quantities, while the 433MHz version is priced at $283 and the 400MHz is $246. The Mobile AMD-K6-2-P/475MHz is priced at $209, in 1,000-unit quantities. The 450MHz version is priced at $189, and the 433MHz is $159, also in quantities of 1,000.